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CI5X Series Impact Crushers

CI5X series impact crusher is a new generation of coarse and medium crushed products designed to meet customers needs for high profit, low cost, energy saving and consumption reduction. It is the guarantee for large-volume production line c

Mining, metallurgy, construction, chemical, cement, refractory material, etc.

Parameter


Model Specifications (mm) Feed opening (mm) Max. feed size (mm) Capacity (t/h) Power (kW) Weight (t) Dimensions (mm)
CI5X1315 Φ1300×1500 1540×930 600 250-350 250 20 2880×2755×2560
CI5X1520 Φ1500×2000 2040×520 (2040×995) 350(700) 400-600 2×250 (2×200) 30 3390×3520×2790
CI5X1415 Φ1400×1500 1540×1320 900 350-550 250 24 2995×2790×3090
CI5X1620 Φ1600×2000 2040×1630 1100 500-900 2×200 42 3485×3605×3720
CI5X2023 Φ2000×2300 2400×1920 1300 1200-2000 2×500 76 4890×4380×4765
  • 1. Semiconductor manufacturing process : Hitachi

    In the manufacturing process of IC, electronic circuits with components such as transistors are formed on the surface of a silicon crystal wafer. Basics of IC formation. A thin film layer that will form the wiring, transistors and other components is deposited on the wafer (deposition). The thin film is coated with photoresist. The circuit pattern of the photomask (reticle) is then projected ...

  • Semiconductor device fabrication - Wikipedia

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    2019-10-15  Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically the metal-oxide-semiconductor (MOS) devices used in the integrated circuit (IC) chips that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps (such as ...

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  • Manufacturing: From Wafer to Chip - An Introduction

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  • Back end of line - Wikipedia

    2019-9-29  The back end of line (BEOL) is the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer, the metalization layer. Common metals are copper and aluminum.[1] BEOL generally begins when the first layer of metal is deposited on the wafer. BEOL includes ...

  • HOME >> Product >>wafer line process flow

    Wafer and Waffle Production Flow KEHUA waferline. Wafer and Waffle Production Flow. Automatic Flat Wafer Production Line. Batter mixing: Before production process, 25kg flour and 40kg water are poured into the wafer batter mixer to get agitated. After 35 minutes, corresponding wafer batter, with the volume of about 65L, is created. Get Price

  • Control in Semiconductor Wafer Manufacturing

    2017-7-19  of the wafer stage with nm accuracy is necessary and control of temperature for the bake process is very important. In RTP, precise control of temperature is a must. Control of pressure, temperature, and flow is ubiquitous. Robotics (wafer handling) is omnipresent in the fab. The semiconductor manufacturing process flow, when

  • Semiconductor Manufacturing Technology

    2017-2-17  Flow of byproducts and process gases Anode electrode Electromagnetic field Ion sheath Chamber wall Positive ion Etchant gas entering gas inlet RF coax cable Photon Wafer Cathode electrode Radical chemical Vacuum line Exhaust to vacuum pump Vacuum gauge e - • The etch process creates a permanent pattern on the wafer in areas not protected by

  • No Slide Title

    2013-4-16  Wafer- or Chip-Level Test Description IC Design Verification Pre-Production Wafer level Characterize, debug and verify new chip design to insure it meets specifications. In-Line Parametric Test Wafer fabrication Wafer level Production process verification test performed early in the fabrication cycle (near front-end of line) to monitor process.

  • Control in Semiconductor Wafer Manufacturing

    2017-7-19  of the wafer stage with nm accuracy is necessary and control of temperature for the bake process is very important. In RTP, precise control of temperature is a must. Control of pressure, temperature, and flow is ubiquitous. Robotics (wafer handling) is omnipresent in the fab. The semiconductor manufacturing process flow, when

  • Manufacturing: From Wafer to Chip - An Introduction

    2014-10-9  A modern wafer will undergo this process around 50 times or so before creating the final finished chip. You might want to know how all of this etching actually creates transistors, so we’ll once ...

  • HOME >> Product >>wafer line process flow

    Wafer and Waffle Production Flow KEHUA waferline. Wafer and Waffle Production Flow. Automatic Flat Wafer Production Line. Batter mixing: Before production process, 25kg flour and 40kg water are poured into the wafer batter mixer to get agitated. After 35 minutes, corresponding wafer batter, with the volume of about 65L, is created. Get Price

  • Quality Assurance in the Project Approval Stage - ISSI

    2017-4-19  Wafer acceptance test (WAT) data by lot indicate key process measurements tested to specified limits. Packaged units are periodically monitored for reliability based on package family and assembly line. 2) Wafer Process Flow and In-line Control The generic wafer process flow and major control items are shown in Figure 3-1

  • Semiconductor Manufacturing Technology

    2017-2-17  Flow of byproducts and process gases Anode electrode Electromagnetic field Ion sheath Chamber wall Positive ion Etchant gas entering gas inlet RF coax cable Photon Wafer Cathode electrode Radical chemical Vacuum line Exhaust to vacuum pump Vacuum gauge e - • The etch process creates a permanent pattern on the wafer in areas not protected by

  • Process Excursion Detection using Statistical Analysis ...

    2014-1-6  reduction in backside wafer cooling gas flow. Process excursions are generally detected, in best cases, at downstream OLPM (on-line production monitor) data collection. Unfortunately, worst case scenarios are not detected until electrical testing at the first metal layer or end-of-line wafer sort yields. The detection and con-tainment of ...

  • What is a Silicon Wafer? Silicon Valley Microelectronics

    The stock removal process removes a very thin layer of silicon and is necessary to produce a wafer surface that is damage-free. On the other hand, the final polish does not remove any material. During the stock removal process, a haze forms on the surface of the wafer, so an extra polishing step gives the wafer a mirror finish.

  • Semiconductor Packaging Assembly Technology

    2011-12-10  The wafer saw process cuts the individual die from the wafer ... pact the subsequent wire bond process. Typical Bond line thickness is between 1 to 2 mils. WIRE BOND Wire bonds are the most common means of providing an ... Semiconductor Packaging

  • Solar Cell Production: from silicon wafer to cell

    Depending on the smoothness of the production process and the basic silicon wafer material quality, the final outcome in form of a solar cell is then further graded into different solar cell quality grades. TO OUR READERS: In this article we went through the standard production process from silicon wafer

  • CMOS Process Flow (五)路漫漫吾尚需求索 - 知乎

    2017-4-4  到此为止,整个CMOS process flow就介绍完了。集成电路工艺凝结了迄今为止人类智慧的结晶,以65nm为例,制作一片65nm process的wafer,平均来说需要大概33层mask,700多道工序,历时两个多月生产完毕。这里再介绍一下制作集成电路的主要操作工序。

  • Solar Cell Production: from silicon wafer to cell

    Depending on the smoothness of the production process and the basic silicon wafer material quality, the final outcome in form of a solar cell is then further graded into different solar cell quality grades. TO OUR READERS: In this article we went through the standard production process from silicon wafer

  • Semiconductor Manufacturing Technology

    2013-4-20  Semiconductor Manufacturing Technology 2/41 by Michael Quirk and JulianSerda Objectives After studying the material in this chapter, you will be able to: 1. Draw a diagram showing how a typical wafer flows in a sub-micron CMOS IC fab. 2. Give an overview of the six major process areas and the sort/test area in the wafer fab. 3.

  • Plasma Dicing of Si Wafers with Panasonic APX300

    2018-11-21  〇Panasonic has not only many equipment patents, but also process patents. 〇Examples of Panasonic’s fundamental patents USP8,513,097 Fundamental equipment patent for wafer with dicing frame USP6,897,128 Process patent for process flow of plasma dicing USP7,964,449 Process patent for Laser scribe + Plasma dicing

  • Wafer and Waffle Production Flow KEHUA

    2018-3-23  Wafer and Waffle Production Flow. ... Automatic Flat Wafer Production Line. Batter mixing: Before production process, 25kg flour and 40kg water are poured into the wafer batter mixer to get agitated. After 3-5 minutes, corresponding wafer batter, with the volume of about 65L, is created. ...

  • THERMAL OXIDATION, IMPLANT CORROSÃO (ETCHING ...

    flow of gas running over the wafers (very similar to oxidation except using a different gas other than oxygen) • Ion Implant - shoots the desired dopant ions into the wafer (uses an electric field) - can only process a single wafer at a time Silicon Wafer Processing

  • 晶圆封装测试工序和半导体制造工艺流程(Wafer assembly ...

    2017-7-24  晶圆封装测试工序和半导体制造工艺流程(Wafer assembly test process and semiconductor manufacturing process).doc 10页 本文档一共被下载: 次 ,您可全文免费在线阅读后下载本文档。

  • A Bumping Process for 12 Wafers

    2014-3-7  Figure 2 shows a process flow for the wafer level CSP and low cost redistribution process based on electroless Ni/Au bumping and semiadditive electroless copper plating on a special dielectric. With this process not only wafer level redistribution is possible. This process is the key process for integration in a wafer level CSP.

  • Wafer Process Systems, Inc. - San Jose manufacturer

    Wafer Process Systems Inc. is a manufacturer of manual, semi-automated and fully-automated dry In / dry out wet benches and wet chemical process equipment used in the manufacturing of microelectronic devices, MEMS devices, computer disc drive media and slider assemblies, flat panel displays and photovoltaic products.

  • Single Wafer Carrier can speed rush lots_SEMI大半导体产业网

    Regarding the model, our studies deal with the Back End Line flow, composed of more than 220 elementary steps processed on 28 groups of process tools. These groups can count up to 6 machines and all the process flow represents 14 mask layers.

  • Introduction to Semico nductor Manufacturing and FA

    2017-10-10  Introduction to Semico nductor Manufacturing and FA Process IPC Technical Seminar Kenny Seon (IFKOR QM IPC) ... • Introduce semiconductor process flow from wafer fabrication to package assembly and final test, and what the semiconduc ... line Package) P-DSO 430mils (Plastic Dual-in-line Small Outline) MQFP

  • Role of process-induced wafer geometry changes in

    Wafer geometry is a broad term that describes measurements of the shape, flatness, and roughness of a wafer. Quantities such as bow, warp, site flatness, nanotopography, and roughness (Figure 1) are all measurements of wafer geometry and play a role in the performance of semiconductor manufacturing processes at different points in the process flow.

  • 2.5 Fabrication - TU Wien

    2011-2-22  2.5.4 Diffusion Diffusion is a key task of semiconductor wafer processing. Although dopants are generally introduced into a wafer by ion implantation, rather than thermally in a furnace, there is unavoidable diffusion of the dopants during any high temperature process step.

  • WLCSP+ and eWLCSP in Flexline: Innovative Wafer Level ...

    2019-10-11  into a standardized wafer (or panel) shape for the subsequent process steps as shown in Figure 1. advanced wafer level packages otherwise unattainable with Figure 1. The FlexLine Process Flow The reconstitution process as shown on the left in Figure 1 includes four main steps. 1) The reconstitution process starts by laminating an

  • Advanced Process Control in Semiconductor Manufacturing

    2013-3-11  Advanced Process Control in Semiconductor Manufacturing Tom Sonderman Costas Spanos. Outline The Challenge ... Wafer State Process State Process Model (to next tool) Updated Recipe Modified Recipe In-Situ Sensors Metrology ... Flow of Data Flow

  • 3D-NAND Flash and Its Manufacturing Process 79

    2016-4-29  one etch process; multiple masks would be necessary. Depending on the process, 10 different contact-hole depths can usually be etched in one etch process, and thus four masks and four etch processes are needed to etch all of the contact holes in the staircase and periphery of a 32-cell-stack 3D-NAND flash device.

  • Wafer Processing - Micross Wafer Fabrication Bare

    Micross is the largest worldwide value-added bare die processor and distributor with a comprehensive array of capabilities to fully process wafers; from wafer saw to wafer

  • Stanley Yee - Wafer Level New Equipment Senior Engineer ...

    new equipment development in wafer level technologies, such stealth laser dicing, coating process, dbg 1.equipment assessment for new process flow 2.gap analysis to current process mode, 3.equipment setup and buy off

  • Defect Engineering During Czochralski Crystal Growth

    2018-9-25  Defect Engineering During Czochralski Crystal Growth ... The process starts with melting the polysilicon charge by applying high power to the heater. Once the charge is molten, the melt flow is stabilized under steady ... manufacturing flow of the silicon wafer is shown in Fig. 2. Wafer manufacturing follows the crystal growth process. First ...

  • Opportunities and Challenges for Fan-out Panel Level ...

    2018-6-11  Opportunities and Challenges for Fan-out Panel Level Packaging (FOPLP) T. Braun (1), ... FOWLP/FOPLP Process Flow Options Die assembly on carrier Wafer/panel overmolding ... IZM Wafer Level Packaging Line (RDL) for Wafer Sizes 100 mm / 150 mm / 200mm / 300 mm

  • Patterned wafer geometry (PWG) metrology for

    several years, a similar Patterned Wafer Geometry (PWG) metrology tool is able to measure in-process patterned wafers. The apparent surface seen by an interferometer may be different than the true surface due to transparent thin films, a discrepancy that we call false topography .


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